PCB CApabilities
PCB Capabilities at COFAN
With over 25 years of expertise in thermal management solutions, COFAN delivers advanced PCB and MCPCB manufacturing services tailored to your needs. Whether you require a single-layer PCB design or a complex multi-layered PCB, we support you from prototype to full-scale production, ensuring cost efficiency through our state-of-the-art facilities in Taiwan and China.
MCPCB Capabilities
COFAN specializes in Metal-Core Printed Circuit Boards (MCPCBs), designed with integrated heat sinks to optimize thermal performance. Using dielectric polymer pre-preg materials, our MCPCBs reduce thermal resistance and transfer heat 8–12 times faster than standard FR4 PCBs. This makes them ideal for high-power applications such as LED lighting, DC-DC converters, and military-grade electronics.
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Single Sided Capabilities
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• Single sided with metal base • Wide selection of thermally conductive pre-preg • Fully automated production line for competitive pricing |
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Double Sided Capabilities
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• Single sided SMT with metal base • Surface mounting on the top layer with all connections done on Layer2 • More room, more BOM, more functions |
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Multi Layer Capabilities
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• Single sided SMT with metal base • Surface mounting on the top layer with all connections done on layer 2 and 3, with EMI on layer 4 • Thermal and electric vias • Chassis vias |
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FR-4 Capabilities
General Capabilities
• Single sided
• Double sided
• Multilayer
• Buried vias
• Blind vias
• Single sided
• Double sided
• Multilayer
• Buried vias
• Blind vias
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Special Capabilities
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Attribute: see (*) below as applies
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S/Sided
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D/Sided
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Multilayer
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Advanced
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Minimum Line/Spacing, Internal Layer
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N/A
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N/A
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0.004”/ 0.004”
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0.003”/ 0.003”
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Minimum Line/Spacing, External Layer
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0.007”/ 0.008
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0.007”/ 0.008
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0.005”/ 0.005”
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0.003”/ 0.003”
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Aspect Ratio (Thickness to Drill)
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6:1
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6:1
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8:1
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10:1
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Minimum Drilled Hole Size
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0.010”
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0.08”
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0.08”
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0.08”
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Land Size Internal (Diameter Over Drill)
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N/A
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N/A
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0.015”
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0.012”
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Land size External (Diameter Over Drill)
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0.012”
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0.012”
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0.012”
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0.010”
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Plane Clearance (Diameter Over Drill)
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0.030”
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0.030”
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0.030”
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0.024”
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Plated Hole Tolerance
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+/- 0.003”
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+/- 0.003”
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+/- 0.003”
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+/- 0.003”
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Minimum Dielectric Thickness
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N/A
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N/A
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0.0025”
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0.002”
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Minimum Core Thickness
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N/A
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N/A
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0.004”
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0.003”
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Minimum PCB Thickness **
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0.017”
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0.018”
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0.020”
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0.020”
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Maximum PCB Thickness
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0.125”
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0.125”
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0.250”
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0.250”
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Thickness Tolerance (%)
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+/- 10
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+/- 10
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+/- 10
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+/- 5
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Maximum Board Dimensions *
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16” x 52”
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19” x 22” *
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17” x 23”
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17” x 23” *
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Fabrication Tolerances (overall dimension)
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+/- .010”
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+/- .010”
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+/- .010”
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+/- .005”
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Bow and Twist (Through Hole) %
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1.5
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1.5
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1.5
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1
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Bow and Twist (SMT) %
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0.75
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0.75
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0.75
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0.75
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Minimum Conductor to Edge
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0.015”
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0.015”
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0.015”
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0.010”
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Layer to Layer Registration Tolerance
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N/A
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0.004”
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0.004”
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0.003”
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Component Pitch
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0.025”
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0.025”
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0.025”
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0.015”
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Soldermask Clearance
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0.005”
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0.005”
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0.005”
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0.004”
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Soldermask Dams
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0.005”
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0.005”
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0.005”
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0.004”
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Impedance Tolerance (>50 Ohms) %
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+/- 10
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+/- 10
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+/- 10
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+/- 8
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Maximum Layers
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1
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1
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12
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16
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Minimum Copper Weight Inners (oz.)
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N/A
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N/A
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1/4
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Maximum Copper Weight Int. Ground (oz.)
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N/A
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N/A
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3
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8
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Maximum Copper Weight Int. Signal (oz.)
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N/A
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N/A
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2
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6
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Maximum Copper Weight Ext. Ground (oz.)
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4
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4
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2
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10
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Maximum Copper Weight Ext. Signal (oz.)
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4
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4
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3
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10
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Customizable PCB & MCPCB Designs
We offer fully customizable PCB solutions, regardless of layer count. Our engineering team can incorporate a wide range of via options, including:
Thermal vias for efficient heat dissipation
Filled vias for improved electrical performance
Blind vias for advanced circuit density
Hybrid via designs for complex applications
Our UL-approved dielectric materials provide superior thermal conductivity and safety, making COFAN a trusted partner for demanding industries.
Advanced Thermal Management Innovations
For extreme LED lighting applications, we recommend our patented Super Pillar Technology, which delivers exceptional thermal conductivity up to 300W/mK. This breakthrough solution ensures long-lasting performance even under intense thermal loads. Additionally, COFAN offers bendable and flexible PCB materials, enabling innovative designs with unique shapes and angles, especially for next-generation lighting applications.